M.tech Electronics Seminar Topics
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Moletronics- an invisible technology
Semiconductor integration beyond Ultra Large Scale Integration (ULSI), through conventional electronic technology facing some problems with fundamental physical limitations. Beyond ULSI, a new technology may become competitive to semiconductor technology. This new technology is known is as Molecular Electronics.Molecular based electronics can overcome the fundamental physical and economic issues limiting Si technology. Here, molecules will be used in place of semiconductor, creating electronic circuit small that their size will be measured in atoms. By using molecular scale technology, we can realize molecular AND gates, OR gates, XOR gates etc.The dramatic reduction in size, and the sheer enormity of numbers in manufacture, are the principle benefits promised by the field of molecular electronics.
FADEC (Full Authority Digital Engine Control)
It is the acronym for Full Authority Digital Engine Control. It is a system consisting of a digital computer (called EEC /Electronic Engine Control/ or ECU /Electronic Control Unit/) and its related accessories which control all aspects of aircraft engine performance. FADECs have been produced for both piston engines and jet engines, their primary difference due to the different ways of controlling the engines.The aircraft's thrust lever sends electrical signals (pilot's command, may also be the autothrottle) to the FADEC. The FADEC digitally calculates and precisely controls the fuel flow rate to the engines giving precise thrust. In addition to the fuel metering function, the FADEC performs numerous other control and monitoring functions such as Variable Stator Vanes (VSV's) and Variable Bleed Valves (VBV's) control, cabin bleeds and power off-takes control, control of starting and re-starting, turbine blade and vane cooling and blade tip clearance control, thrust reversers control, engine health monitoring, oil debris monitoring and vibration monitoring. The inputs come from various aircraft and engine sensors. Apart from the key parameters that are monitored for a safe thrust control (shaft rotational speeds, pressures and temperatures at various points along the gas path) the FADEC also monitors hundreds of various analog, digital and discrete data coming from the engine subsystems and related aircraft systems, providing a fully redundant and fault tolerant engine control.
Surface Mount Technology
Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
Extreme ultraviolet (EUV) lithography
Extreme ultraviolet lithography (also known as EUV or EUVL) is a next-generation lithography technology using an extreme ultraviolet (EUV) wavelength, currently expected to be 13.5 nm.EUVL faces specific defect issues analogous to those being encountered by immersion lithography. Whereas the immersion-specific defects are due to unoptimized contact between the water and the photoresist, EUV-related defects are attributed to the inherently ionizing energy of EUV radiation. The first issue is positive charging, due to ejection of photoelectrons freed from the top resist surface by the EUV radiation. This could lead to electrostatic discharge or particle contamination as well as the device damage mentioned above. A second issue is contamination deposition on the resist from ambient or outgassed hydrocarbons, which results from EUV- or electron-driven reactions. A third issue is etching of the resist by oxygen
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