Trench Less Technology
Submerged Floating Tunnel
Cryogenic Grinding
Fuzzy logic in Aircraft stability
Airport management
Hydro Drive
High angle of attack aerodynamics
Frictionless Compressor Technology
Conditional monitoring & fault Diagnosis
Bio-degradable polymers
Metal-Matrix Composite Processing
Mechanical torque limitors
Ceramic fastners
Multi Valve Engine
Pump Noise level reduction methods
Polymers castings
Biomass Fuelled Power Plant
Low Gloss ABS system
Nanorobotics
Fuel Cells on Aerospace
Wind engineering
Aircraft design
BlueTec
Stealth Technology
Opto-Electronic Sensor System
Concurrent Engineering
Bose suspension system
Plastic Welding
Oil well drilling
Light weight material-Carbon fibre
Guided Missile
Heat Pipe
Fuel Energizer
Flywheel Batteries
Miller Cycle Gas Engine
Emission Control Techniques
Defectivity Avoidance in Chemical Mechanical Planarization
Defectivity is of paramount importance in integrated circuit (IC) manufacturing industry. Defects such as scratches and interface delaminations are responsible for significant yield-loss in Chemical Mechanical Planarization (CMP), which is a necessary process step in IC manufacturing. The defectivity tolerances, due to continuously shrinking feature size, have become much more stringent in recent years. A mechanistic model for wafer scale and die scale non-uniformities, as well as prediction of scratch propensity in Chemical Mechanical Planarization (CMP) processes has been developed. This is embodied in a CMPSim simulation package available for use over the web. The insight gained from this work leads to development of slurry characteristics, pad characteristics, as well as a counter-gimbaling mechanism for CMP machine development that can significantly reduce scratch propensity.
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